| Manufacturing Technology: | Integrated Circuits Device |
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| Material: | Element Semiconductor |
| Type: | Both N and P Type |
| Package: | PGA(Pin Grid Array Package) |
| Application: | IC |
| Size: | 8 Inches |
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Audited Supplier Product Description
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Perfect for microfluidics applications. For microelectronics or MEMS applications, please contact us for detailed specs. While semiconductor devices continue to shrink, it is becoming increasingly important for wafers to have high surface quality on both their front and back side. Currently these wafers are most common in microelectromechanical systems (MEMS), wafer bonding, silicon on insulator (SOI) fabrication, and applications with tight flatness requirements. Microelectronics acknowledges the evolution of the semiconductor industry and is committed to finding long term solutions for all customer requirements. Large stock of double side polished wafers in all wafer diameters ranging from 100mm to 300mm. If your specification is not available in our inventory, we have established long term relationships with numerous vendors that are capable of custom manufacturing wafers to fit any unique specifications. Double side polished wafers are available in silicon, glass and other materials commonly used in the semiconductor industry. Customized dicing and polishing is also available according to your requirements. |
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More details
Product feature
· 8" P/N type, Polished silicon wafer (25 pcs)
· Orientation: 200
· Resistivity: 0.1 - 40 ohm•cm (It may vary from batch to batch)
· Thickness: 725+/-20um
· Prime/Monitor/Test Grade
Why choose us?
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Audited Supplier 
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